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複数の Qualcomm Snapdragon 製品におけるバッファエラーの脆弱性
Title 複数の Qualcomm Snapdragon 製品におけるバッファエラーの脆弱性
Summary

Snapdragon Automobile、Snapdragon Mobile および Snapdragon Wear には、バッファエラーの脆弱性が存在します。

Possible impacts ベンダ情報および参考情報を参照して適切な対策を実施してください。
Solution

ベンダより正式な対策が公開されています。ベンダ情報を参照して適切な対策を実施してください。
Publication Date April 2, 2018, midnight
Registration Date Oct. 3, 2018, 3:58 p.m.
Last Update Oct. 3, 2018, 3:58 p.m.
CVSS3.0 : 緊急
Score 9.8
Vector CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
CVSS2.0 : 危険
Score 7.5
Vector AV:N/AC:L/Au:N/C:P/I:P/A:P
Affected System
クアルコム
MDM9206 ファームウェア 
MDM9607 ファームウェア 
MDM9635M ファームウェア 
MDM9650 ファームウェア 
SD 205 ファームウェア 
SD 210 ファームウェア 
SD 212 ファームウェア 
SD 415 ファームウェア 
SD 615 ファームウェア 
SD 616 ファームウェア 
SD 625 ファームウェア 
SD 835 ファームウェア 
CVE (情報セキュリティ 共通脆弱性識別子)
CWE (共通脆弱性タイプ一覧)
ベンダー情報
Change Log
No Changed Details Date of change
1 [2018年10月03日]
  掲載		 Oct. 3, 2018, 3:58 p.m.
NVD Vulnerability Information
CVE-2018-5878
Summary

While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.

Publication Date July 7, 2018, 2:29 a.m.
Registration Date March 1, 2021, 7:32 p.m.
Last Update Nov. 21, 2024, 1:09 p.m.
Affected software configurations
Configuration1 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
Configuration2 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
Configuration3 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:*
Configuration4 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
Configuration5 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
Configuration6 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
Configuration7 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
Configuration8 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
Configuration9 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
Configuration10 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
Configuration11 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
Configuration12 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
Related information, measures and tools
Common Vulnerabilities List