NVD Vulnerability Detail
Search Exploit, PoC
CVE-2019-19196
Summary

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

Publication Date Feb. 13, 2020, 12:15 a.m.
Registration Date Jan. 26, 2021, 11:41 a.m.
Last Update Nov. 21, 2024, 1:34 p.m.
CVSS3.1 : MEDIUM
スコア 6.5
Vector CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
攻撃元区分(AV) 隣接
攻撃条件の複雑さ(AC)
攻撃に必要な特権レベル(PR) 不要
利用者の関与(UI) 不要
影響の想定範囲(S) 変更なし
機密性への影響(C) なし
完全性への影響(I) なし
可用性への影響(A)
CVSS2.0 : LOW
Score 3.3
Vector AV:A/AC:L/Au:N/C:N/I:N/A:P
攻撃元区分(AV) 隣接
攻撃条件の複雑さ(AC)
攻撃前の認証要否(Au) 不要
機密性への影響(C) なし
完全性への影響(I) なし
可用性への影響(A)
Get all privileges. いいえ
Get user privileges いいえ
Get other privileges いいえ
User operation required いいえ
Affected software configurations
Configuration1 or higher or less more than less than
cpe:2.3:a:telink-semi:tlsr8258_ble_sdk:*:*:*:*:*:*:*:* 3.4.0
execution environment
1 cpe:2.3:h:telink-semi:tlsr8258:-:*:*:*:*:*:*:*
Configuration2 or higher or less more than less than
cpe:2.3:a:telink-semi:tlsr8269_ble_sdk:*:*:*:*:*:*:*:* 3.3
execution environment
1 cpe:2.3:h:telink-semi:tlsr8269:-:*:*:*:*:*:*:*
Configuration3 or higher or less more than less than
cpe:2.3:a:telink-semi:tlsr8253_ble_sdk:*:*:*:*:*:*:*:* 3.4.0
execution environment
1 cpe:2.3:h:telink-semi:tlsr8253:-:*:*:*:*:*:*:*
Configuration4 or higher or less more than less than
cpe:2.3:a:telink-semi:tlsr8251_ble_sdk:*:*:*:*:*:*:*:* 3.4.0
execution environment
1 cpe:2.3:h:telink-semi:tlsr8251:-:*:*:*:*:*:*:*
Configuration5 or higher or less more than less than
cpe:2.3:a:telink-semi:tlsr8232_ble_sdk:*:*:*:*:*:*:*:* 1.3.0
execution environment
1 cpe:2.3:h:telink-semi:tlsr8232:-:*:*:*:*:*:*:*
Related information, measures and tools
Common Vulnerabilities List

JVN Vulnerability Information
Telink Semiconductor BLE SDK の 複数の TLSR 製品における古典的バッファオーバーフローの脆弱性
Title Telink Semiconductor BLE SDK の 複数の TLSR 製品における古典的バッファオーバーフローの脆弱性
Summary

Telink Semiconductor BLE SDK の TLSR8x5x、TLSR823x、TLSR826x には、古典的バッファオーバーフローの脆弱性が存在します。

Possible impacts サービス運用妨害 (DoS) 状態にされる可能性があります。
Solution

ベンダ情報および参考情報を参照して適切な対策を実施してください。

Publication Date Nov. 21, 2019, midnight
Registration Date March 9, 2020, 11:48 a.m.
Last Update March 27, 2020, 1:39 p.m.
Affected System
Telink
TLSR8232 BLE SDK 1.3.0 まで
TLSR8251 BLE SDK 3.4.0 まで
TLSR8253 BLE SDK 3.4.0 まで
TLSR8258 BLE SDK 3.4.0 まで
TLSR8269 BLE SDK 3.3 まで
CVE (情報セキュリティ 共通脆弱性識別子)
CWE (共通脆弱性タイプ一覧)
ベンダー情報
その他
Change Log
No Changed Details Date of change
1 [2020年03月09日]
  掲載
March 9, 2020, 11:48 a.m.
2 [2020年03月27日]
  参考情報:ICS-CERT ALERT (ICS-ALERT-20-063-01) を追加
March 27, 2020, 10:33 a.m.