NVD Vulnerability Detail
Search Exploit, PoC
CVE-2019-2237
Summary

Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130

Publication Date July 26, 2019, 2:15 a.m.
Registration Date Jan. 26, 2021, 11:41 a.m.
Last Update Nov. 21, 2024, 1:40 p.m.
CVSS3.0 : MEDIUM
スコア 5.5
Vector CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:H/A:N
攻撃元区分(AV) ローカル
攻撃条件の複雑さ(AC)
攻撃に必要な特権レベル(PR)
利用者の関与(UI) 不要
影響の想定範囲(S) 変更なし
機密性への影響(C) なし
完全性への影響(I)
可用性への影響(A) なし
CVSS2.0 : LOW
Score 2.1
Vector AV:L/AC:L/Au:N/C:N/I:P/A:N
攻撃元区分(AV) ローカル
攻撃条件の複雑さ(AC)
攻撃前の認証要否(Au) 不要
機密性への影響(C) なし
完全性への影響(I)
可用性への影響(A) なし
Get all privileges. いいえ
Get user privileges いいえ
Get other privileges いいえ
User operation required いいえ
Affected software configurations
Configuration1 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
Configuration2 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
Configuration3 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
Configuration4 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
Configuration5 or higher or less more than less than
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
Configuration6 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
Configuration7 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
Configuration8 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
Configuration9 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
Configuration10 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
Configuration11 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_675:-:*:*:*:*:*:*:*
Configuration12 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:*
Configuration13 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:*
Configuration14 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:*
Configuration15 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_730:-:*:*:*:*:*:*:*
Configuration16 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_8cx:-:*:*:*:*:*:*:*
Configuration17 or higher or less more than less than
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sxr1130:-:*:*:*:*:*:*:*
Related information, measures and tools
Common Vulnerabilities List

JVN Vulnerability Information
複数の Snapdragon 製品におけるエラー処理に関する脆弱性
Title 複数の Snapdragon 製品におけるエラー処理に関する脆弱性
Summary

複数の Snapdragon 製品には、エラー処理に関する脆弱性が存在します。

Possible impacts 情報を改ざんされる可能性があります。
Solution

ベンダより正式な対策が公開されています。ベンダ情報を参照して適切な対策を実施してください。

Publication Date Jan. 7, 2019, midnight
Registration Date July 30, 2019, 10:04 a.m.
Last Update July 30, 2019, 10:04 a.m.
Affected System
クアルコム
MDM9206 ファームウェア 
MDM9607 ファームウェア 
MDM9650 ファームウェア 
MDM9655 ファームウェア 
QCS605 ファームウェア 
SD 205 ファームウェア 
SD 210 ファームウェア 
SD 212 ファームウェア 
SD 410 ファームウェア 
SD 412 ファームウェア 
CVE (情報セキュリティ 共通脆弱性識別子)
CWE (共通脆弱性タイプ一覧)
ベンダー情報
Change Log
No Changed Details Date of change
1 [2019年07月30日]
  掲載
July 30, 2019, 10:04 a.m.